four-in-one Test Frame for iPhone 13/Mini / PRO / MAX

Using 0.5mm imported pure copper gold-plated probe, its conductivity can better connect the motherboard accurately

Solve problems such as repeated lamination and delamination during the rework process, troublesome testing, etc., making motherboard testing simple and fast

Improve maintenance efficiency and reduce maintenance risks

The product is processed and produced by a high-precision CNC machining center, which can effectively improve the accuracy of the product

function test:
Power on, display/touch/camera/flash/photosensitive distance/earpiece/speaker/leveling/WIOFI/facial recognition, etc.

Operation method:
1. Place the lower layer of the motherboard on the test frame
2. Place the test needle board corresponding to the motherboard
3. Place the lower main board on the needle board
4. Buckle the cable and start the test